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5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

Produkt-Details:

Herkunftsort:	China
Markenname:	HUITIAN
Zertifizierung:	RoHS REACH
Modellnummer:	5280

Ausführliche Information

Herkunftsort:

China

Markenname:

HUITIAN

Zertifizierung:

RoHS REACH

Modellnummer:

5280

Physische Form:

Paste

Farbe Teil A:

Graue Flüssigkeit

Farbe Teil B:

Weiße Flüssigkeit

Viskosität Teil A:

2.000 ~ 3.500 MPa · s

Viskosität Teil B:

2.000 ~ 3.500 MPa · s

Mischverhältnis:

1: 1

Betriebszeit @ 25 °C:

60-240 Minuten

Haltbarkeitszeit @ 80°C:

Minuten ≤30

Härte:

10 ~ 30 Ufer a

Volumenwiderstand:

1.0*10^12 Ω∙cm

Dielektrische Stärke:

≥ 14 KV/mm

Wärmeleitfähigkeit:

≥0,6 w/(m • k)

Hervorheben:

gray silicone potting compound , high thermal conductivity potting compound , electronics silicone potting compound

Handelsinformationen

Min Bestellmenge:

200 kg

Preis:

Verhandelbar

Verpackung Informationen:

20 kg/Barrel

Lieferzeit:

5-8 Tage

Zahlungsbedingungen:

L/c, t/t

Versorgungsmaterial-Fähigkeit:

2000t/Monat

Produkt-Beschreibung

5280 Two-Part 1:1 Gray Silicone Potting Compound For Electronics

High-performance potting compound designed for module power supply, LED drive power supply, network transformer, reversing radar, and other electronic applications. Provides moistureproof, anti-corrosion, and shock-proof protection.

Product Attributes

Attribute	Value
Physical Form	Paste
Color Part A	Gray fluid
Color Part B	White fluid
Viscosity Part A	2,000~3,500 mPa·s
Viscosity Part B	2,000~3,500 mPa·s
Mixing Ratio	1:1
Operating Time @25 °C	60-240 mins
Curing Time @80℃	≤30 mins
Hardness	10~30 Shore A
Volume resistivity	1.0*10^12 Ω∙cm
Dielectric strength	≥14 KV/mm
Thermal Conductivity	≥0.6 W/(m•K)

Product Description

5280 Potting Compound is a high-performance, two-part addition-type silicone rubber designed specifically for the electronics industry. This gray, high thermal conductive compound offers exceptional insulation properties, flame retardancy, and mechanical stability over a wide temperature range. It is ideal for protecting sensitive electronic components from environmental hazards while ensuring long-term reliability and performance.

Download Technical Data Sheet (PDF)

Product Applications

Module Power Supplies: Provides moistureproofing and insulation to protect against short circuits and corrosion.
LED Drive Power Supplies: Ensures thermal management and mechanical stability, prolonging the lifespan of LED components.
Network Transformers: Offers excellent insulation and anti-fouling properties to maintain signal integrity.
Reversing Radars: Protects sensitive radar components from moisture and physical shock, ensuring reliable operation.
General Electronics: Suitable for a wide range of electronic components, providing comprehensive protection against moisture, dust, corrosion, and mechanical shock.

Key Product Features

High Thermal Conductivity: With a thermal conductivity of ≥0.6 W/m*K, the compound efficiently dissipates heat, ensuring optimal performance of electronic components.
UL94V-0 Flame Retardant: Meets stringent safety standards, providing excellent fire resistance and reducing the risk of electrical fires.
Excellent Insulation: Features a dielectric strength of ≥14 KV/mm, ensuring reliable electrical insulation and preventing short circuits.
Wide Temperature Range: Maintains rubber elasticity from -50°C to 200°C, ensuring consistent performance in extreme conditions.
RoHS Compliant: Environmentally friendly and compliant with the Restriction of Hazardous Substances Directive.
Ease of Use: 1:1 mix ratio simplifies the application process, ensuring consistent performance and reducing the risk of errors.

Technical Parameters

Physical Properties Before Curing (25 ±2℃, 60%±5%RH)
Appearance (A)	Gray flow
Appearance (B)	White flow
Viscosity (A)	2,000~3,500 mPa*s
Viscosity (B)	2,000~3,500 mPa*s
Curing Properties (A:B=1:1)
Operating Time (25℃)	60~240 min
Curing Time (85℃)	≤30 min
Physical Properties After Curing (25 ±2℃, 60±5%RH, A:B=1:1)
Density	1.70~1.9 g/cm³
Hardness	10~30 Shore A
Shear Strength (PCB)	0.3-0.8 MPa
Thermal Conductivity	≥0.6 W/m*K
Dielectric Strength	≥14 KV/mm
Volume Resistivity	≥1.010¹² Ωcm

Directions for Use

Preparation

Stirring: Fully stir part A and part B separately, either manually or mechanically, to ensure homogeneity and avoid performance changes due to filler settlement.

Mixing

Weighing: Accurately weigh the two parts into a clean container by weight ratio (1:1) and stir well to ensure thorough mixing.

Defoaming

Natural Defoaming: Allow 20-30 minutes for natural defoaming after filling the mixed glue into the components.
Vacuum Defoaming: For faster defoaming, pot the components after pumping for 5-10 minutes at a vacuum degree of 0.08-0.1 MPa.

Potting

Surface Preparation: Ensure the surfaces to be potted are clean and dry. Apply the glue while it still has good flowability to achieve optimal leveling.

Curing

Curing Conditions: The glue can cure at room temperature or by heating. Higher temperatures accelerate curing, and heat curing is recommended in colder conditions (e.g., winter).

Packaging & Storage Conditions

Packaging

5280CA9 (20 kg/barrel), 5280CB9 (20 kg/barrel)

Storage

Store at room temperature in a cool and dry place. The shelf life is 6 months.

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